Thermal paste is a very high heat conductive paste that is used between two objects (usually a heatsink and a CPU/GPU) to get better heat conduction. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. Air is a very poor conductor of heat. Thermal Interface Materials (TIM) can be up to a 100 times greater conductor of heat than air.
However, thermal paste is not near as good of a conductor as copper. Thus, too much thermal paste will hinder a heatsink’s ability to cool properly.
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